Industrial tool

Our ADE Single Side Etch Serie industrial tools deliver throughput values beyond the current industry roadmap. UNIVERSAL etching and texturing equipment and process for any type of silicon wafer or layer; a trully future-proof solution.

Our tools are designed using multiple parallel lines of processing and atmospheric pressure chemical reactors similar to the one used in our development tool. The industrial process is facilitated by the use of on-site generation of the etching gas, providing 100% concentration and delivering low cost of ownership.

Latest News

22/08/23 Selective etching for Advanced TOPCON & IBC

The ADE process meets the selective etching requirements of upcoming "Advanced TOPCON" solar cell architectures and IBC.

14/11/22 ADE for TOPCON cells - EUPVSEC 2022

In Milan's conference, Fraunhofer ISE presented its latest TOPCON cell developments, featuring ADE poly etching.

More news...

Designed for single side etching of poly-silicon layers,  the ADE SS POLY-ETCH is especially suited for TOPCON solar cells and other advanced solar cell architectures.

Designed for single side texturing of silicon wafers. The ADE SS nano-TEX can texture ANY type of Si wafers, removing only a small amount of silicon. 

A new addtion to the ADE tool plateform, the ADE SS E-ETCH will be specifically developped for the single side edge isolation cell process at ultra-high throughput.

> Very small footprint

Modular multi-lanes configurations. 

The ADE SS Poly-ETCH can remove selectively and at very high etch rate the few hundreds of nanometres of a-Si or poly-silicon from one side of the wafer.

Low reflectivity texture:  Outperforming industry standards with wafer surface reflectivity Rw values adjustable to lower levels.

In-line, scalable process

Inline process, high throughput, and on-site generation of etching gases facilitate scalability of the manufacturing process.

NO Green House Gases

Improves the overall sustainability of the manufacturing process; process without any Green House Gases (GHG)resulting in Zero Global Warming Potential (GWP).

Mask-less, single-side processing

The wafer's rear side is preserved. Enables advanced cell architectures, simplify process flow, whilst also reducing processing costs.

Universal, futur-proof Silicon dry etch

Universal silicon etching/texturing solution. Enables the use of diamond wire cut wafers, epitaxial wafers, cast wafers, mono and multi crystalline. Also suitable for Si deposited layers, like amorphous silicon (a-Si) and polysilicon layers.


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